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Specially Designed Microstrip Array with Patterned Ground Plane for Improved Characteristics
D DUTTA, , C KUMAR
Published in Institute of Electrical and Electronics Engineers Inc.
2018
Abstract
This paper presents a symmetric patterned defect introduced on the ground plane of a 2× 2 array of rectangular microstrip patches. A C-band design has been examined by removing nearly 50% metal from ground cladding which promises about 10 dB improvement in co-to-cross-polarized (XP) isolation over ±50° angular range around the boresight compared to a conventional geometry. A single unit has also been repeated in S-band for experimental studies indicating close corroboration with the simulated predictions. © 2018 IEEE.
About the journal
JournalData powered by Typeset2018 IEEE Indian Conference on Antennas and Propagation, InCAP 2018
PublisherData powered by TypesetInstitute of Electrical and Electronics Engineers Inc.
Open AccessNo