The electroless and electrolytic deposition of silver from a solution containing silver nitrate in either an ethylene glycol (EG)-choline chloride based or a urea-choline chloride based ionic liquids has been carried out onto steel and copper cathodes by simple immersion, constant current and constant potential methods at room temperature. It has been found that electroless silver deposits of up to several microns have been obtained by dip coating from both urea and EG based ionic liquids without the use of catalysts. The influences of various experimental conditions on electrodeposition and morphology of the deposited layers have been investigated by scanning electron microscopy (SEM) and X-ray diffraction (XRD). It has been observed that crack free bright metallic coloured silver coatings can be obtained from both EG and urea based ionic liquids at the applied deposition potentials up to-0.40 V and applied deposition current densities up to-5.0 A m-2 at room temperature. The cathodic current efficiency for the deposition of Ag is about 99%.